Continuous High Throughput APCVD for 6 inch or below.
A6300S
- 120WPH at 6 inch and/or smaller dia. Wafers.
- Metal addition Free design and Long Term Stable Process with SiC Tray.
Feature
- High volume production continuous APCVD to meet with user's need to process 120WPM for 6 inch and smaller wafers.
- Developped wider area deposition dispersion head dedicated to A6300S and minimize the number of trays to reduce the cost of system.
- SiC Trays as susceptors prevent heavy metal addition and help long term stable process for long term production.
- Good maintenability and Operators safety are given by automated head base liftting system and automated tray exchange system, that shorten PM time for longer use of system
Performance
| Film Thickness Nu |
≦±4.0％ |
| Wafer Size |
6 inch or the less |
| Gas |
SiH4, O2, PH3, B2H6, N2
|
| Deposition Temp. |
350℃～450℃ |
| Productivity |
120 WPH |
Specifictions
| System Size |
1500mm(W) x 2850mm(D) x 2000mm(H) |
| Heaters |
Heater Coils |
| Loader/Unloader |
Robot Cassette to Cassette Transfer |
| Dispersion Head (Gas Nozzle) |
A63 Type 2 Dispersion Head |
