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HOME  >  PRODUCTS  >  Batch Type APCVD D501

PRODUCTS

Flexible APCVD for Pilot Production and R&D.

D501

  • Batch Type APCVD, with a Large Tray to place variety sizeof Wafers.

Feature

  • Can place wafers on SiC tray manulally. Chips or different size of wafers can be placed on SiC Tray..
  • Small Footprint for R&D and Pilot Production.

Performance

Film Thickness Nu -
Wafer Size Follow heated zone
Gas SiH4, O2, PH3, B2H6,N2,TEOS, TEB, TMOP, O3, TMA, N2
Deposition Temp. 350℃～450℃
Productivity -

Specifictions

System Size 1200㎜(W) x 2480㎜(D) x 1940㎜(H)
Heaters Heater Coils
Loader/Unloader Manual
Dispersion Head (Gas Nozzle) A63 Type 2 Dispersion Head

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